Whether it's highly customized prototype construction or microBGA circuit assembly, our BGA/X-Ray facilities can handle virtually any placement or rework project, including the most demanding fine-pitch QFP parts and SMT headers. Best of all, we can usually turn your rework project around in 1-5 days, depending on the specific requirements. Our SRT Summit system can place or rework any Ball Grid Array (BGA) component, while our high-power Nicolet X-ray is ideal for inspecting BGA and microBGA components. We also offer BGA re-balling services. Today, X-ray inspection is the only reliable way to verify the solder joint integrity on the small BGA assemblies, allowing our technicians to locate failed solder bridging or poor connections between the balls and the board.